Infineon Launches Compact CoolSET SiP for Efficient 60W Power
Infineon Introduces Compact CoolSET™ SiP for Highly Efficient 60 W Power Delivery
Infineon Technologies, a global semiconductor leader renowned for its innovative solutions in power systems and the Internet of Things (IoT), has announced the launch of its new CoolSET™ System in Package (SiP). This highly integrated and compact system power controller is designed to deliver efficient power of up to 60 W across a universal input voltage range of 85 to 305 V AC. Encased in a small Surface Mount Device (SMD) package, the CoolSET SiP incorporates a high-voltage MOSFET with a low Drain-Source On-Resistance (R DS(ON)), effectively eliminating the need for an external heat sink. This integration significantly reduces overall system size and complexity, simplifying design and assembly processes.
The CoolSET SiP leverages zero-voltage switching (ZVS) flyback operation, a technique that minimizes switching losses and reduces electromagnetic interference (EMI) signature. This not only enhances the efficiency of the power delivery but also contributes to improved system reliability and robustness, making the CoolSET SiP an ideal power solution for a wide range of applications, including major home appliances and advanced Artificial Intelligence (AI) servers. Furthermore, the integrated controller simplifies the design process for developers, enabling them to more easily meet stringent energy efficiency standards and create future-proof power solutions for modern electronic designs.
The CoolSET SiP achieves its high level of integration by incorporating a 950 V startup-cell, an 800 V avalanche-rugged CoolMOS™ P7 Superjunction (SJ) MOSFET, a primary-side ZVS flyback controller, a secondary-side synchronous rectification (SR) controller, and reinforced isolated communication facilitated by Infineon’s proprietary Coreless Transformer (CT) Link technology. This comprehensive integration significantly streamlines the development of sophisticated end products by drastically reducing the number of discrete components required, leading to a lower bill of materials (BOM) cost and minimizing the necessary Printed Circuit Board (PCB) space. To further simplify system integration and provide designers with greater flexibility, the CoolSET SiP includes a comprehensive suite of advanced protection features, allowing for optimized solutions and an enhanced overall user experience.
BonChip Electronics is a proud distributor of Infineon Technologies' extensive portfolio of high-quality semiconductor solutions, including the new CoolSET™ System in Package (SiP). We offer full product sales and ordering services for Infineon's complete range, ensuring our customers have access to the latest advancements in integrated power control technology for their home appliance, AI server, and other power supply applications. With a strong commitment to providing the best service and the most convenient delivery options, BonChip Electronics is your trusted partner for sourcing all your Infineon component needs. Contact us today to learn more about how the compact and highly efficient CoolSET SiP can simplify your designs and enhance the power delivery in your applications.
