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06031C561KAJ2A
In Stock
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06031C561KAJ2A Tech Specifications
CAP CER 560PF 100V X7R 0603
Product Attribute | Attribute Value |
---|---|
Category | Capacitors / Ceramic Capacitors |
Manufacturer | AVX Corporation |
Factory Lead Time | 3 Weeks |
Voltage - Rated | 100V |
Thickness (Max) | 0.035" (0.90mm) |
Size / Dimension | 0.063" L x 0.032" W (1.60mm x 0.81mm) |
Packaging | Tape & Reel (TR) |
Operating Temperature | -55°C ~ 125°C |
Lead Style | - |
Height - Seated (Max) | - |
Failure Rate | - |
Applications | General Purpose |
Product Attribute | Attribute Value |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Pbfree Code | yes |
Tolerance | ±10% |
Temperature Coefficient | X7R |
Ratings | - |
Package / Case | 0603 (1608 Metric) |
Mounting Type | Surface Mount, MLCC |
Lead Spacing | - |
Features | - |
Capacitance | 560pF |
06031C561KAJ2A Documents
Download datasheets and manufacturer documentation for 06031C561KAJ2A
Others include "06031" parts
The following parts include '06031'
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0603100R5 | LAPIS Semiconductor | Specialized Hot ICs | 300493 |
0603103K50V40K | Samsung Semiconductor | Specialized Hot ICs | 5445 |
0603104K50V80K | Samsung Semiconductor | Specialized Hot ICs | 5244 |
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060310K5% | LAPIS Semiconductor | Specialized Hot ICs | 1085000 |
060310R5% | LAPIS Semiconductor | Specialized Hot ICs | 2530000 |
060312K5 | LAPIS Semiconductor | Specialized Hot ICs | 60200 |
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06031C561KAJ2A brand manufacturers: AVX Corporation, Bonchip stock, 06031C561KAJ2A reference price. 06031C561KAJ2A parameters, 06031C561KAJ2A Datasheet PDF and pin diagram description download.You can use the 06031C561KAJ2A Pluggable Connectors, DSP Datesheet PDF, find 06031C561KAJ2A pin diagram and circuit diagram and usage method of function, 06031C561KAJ2A electronics tutorials.You can download from the Bonchip.
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Shipping | Delivery Period | Packages will be arranged for delivery within 1-2 days from the date of all items arrive at our warehouse. In stock items can be shipped out within 24 hours. Delivery Time depends on Shipping Method and Delivery Destinations. |
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