T6819-TBQ Tech Specifications

T6819-TBQ datasheet pdf and PMIC - Hot Swap Controllers product details from Atmel (Microchip Technology) stock available at Bonchip

Product Attribute Attribute Value
Category Integrated Circuits (ICs) / Hot Swap Controllers
Manufacturer Atmel (Microchip Technology)
Factory Lead Time 3 Weeks
Mount Surface Mount
Number of Pins 16
JESD-609 Code e3
Number of Terminations 16
Resistance 500mOhm
Max Operating Temperature 150°C
HTS Code 8542.39.00.01
Technology BCDMOS
Terminal Form GULL WING
Number of Functions 1
Terminal Pitch 1.27mm
Pin Count 16
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.25V
Supply Voltage-Min (Vsup) 4.75V
Interface IC Type SIPO BASED PERIPHERAL DRIVER
Turn On Time 20 μs
Turn Off Time 20 μs
Output Current Flow Direction SOURCE SINK
Supply Voltage1-Max 40V
Width 3.8mm
Lead Free Contains Lead
Product Attribute Attribute Value
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Package / Case SOIC
Packaging Cut Tape (CT)
Moisture Sensitivity Level (MSL) 1
ECCN Code EAR99
Terminal Finish Matte Tin (Sn) - annealed
Min Operating Temperature -40°C
Subcategory Peripheral Drivers
Terminal Position DUAL
Peak Reflow Temperature (Cel) 260
Supply Voltage 5V
[email protected] Reflow Temperature-Max (s) 40
Number of Outputs 6
Max Output Current 2A
Power Supplies 57.5/40V
Output Current per Channel 1.5A
Driver Number of Bits 6
Output Peak Current Limit-Nom 2A
Built-in Protections OVER CURRENT; THERMAL; UNDER VOLTAGE
Supply Voltage1-Min 7.5V
Length 9.925mm
RoHS Status RoHS Compliant
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T6819-TBQ Documents

Download datasheets and manufacturer documentation for T6819-TBQ

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T6819-TBQ brand manufacturers: Atmel (Microchip Technology), Bonchip stock, T6819-TBQ reference price. T6819-TBQ parameters, T6819-TBQ Datasheet PDF and pin diagram description download.You can use the T6819-TBQ Pluggable Connectors, DSP Datesheet PDF, find T6819-TBQ pin diagram and circuit diagram and usage method of function, T6819-TBQ electronics tutorials.You can download from the Bonchip.
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