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500-0763-01
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500-0763-01 Tech Specifications
THERMAL IMAGE SENSOR 80HX60V
Product Attribute | Attribute Value |
---|---|
Category | Sensors / Camera Modules |
Manufacturer | FLIR Lepton |
Factory Lead Time | 3 Weeks |
Factory Lead Time | 2 Weeks |
Published | 2015 |
Part Status | Active |
Frames per Second | 8.6 |
Product Attribute | Attribute Value |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Pbfree Code | yes |
Packaging | Tray |
Series | Lepton® 2.5 |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
RoHS Status | RoHS Compliant |
500-0763-01 Documents
Download datasheets and manufacturer documentation for 500-0763-01
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Datasheets
Others include "500-0" parts
The following parts include '500-0'
Part # | Manufacturer | Category | Availability |
---|---|---|---|
500-00001 | Parallax, Inc. | Transistors - Bipolar (BJT) - Single | 2618 |
500-0006848-0000 | Artysen Embedded Technologies | Off-board Power Accessories | |
500-0010-01 | FX | Specialized Hot ICs | 12 |
500-006848-0000 | Astec America (Artesyn Embedded Technologies) | Accessories | 2593 |
500-006848-0000 | Artesyn Embedded Power | Off-board Power Accessories | |
500-020 | SUPERTEX | Specialized Hot ICs | 32 |
500-029 | SUPERTEX | Specialized Hot ICs | 56 |
500-032-000 | 3M | Sockets for ICs, Transistors | 2624 |
500-032-050 | 3M | Sockets for ICs, Transistors | 2599 |
500-040-225-G02 | EDAC Inc. | Specialized Backplane Connectors |
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500-0763-01 brand manufacturers: FLIR Lepton, Bonchip stock, 500-0763-01 reference price. 500-0763-01 parameters, 500-0763-01 Datasheet PDF and pin diagram description download.You can use the 500-0763-01 Pluggable Connectors, DSP Datesheet PDF, find 500-0763-01 pin diagram and circuit diagram and usage method of function, 500-0763-01 electronics tutorials.You can download from the Bonchip.
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Shipping | Delivery Period | Packages will be arranged for delivery within 1-2 days from the date of all items arrive at our warehouse. In stock items can be shipped out within 24 hours. Delivery Time depends on Shipping Method and Delivery Destinations. |
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