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XPC850DEZT50BU Tech Specifications

XPC850DEZT50BU datasheet pdf and Embedded - Microprocessors product details from Freescale Semiconductor, Inc. (NXP Semiconductors) stock available at Bonchip

Product Attribute Attribute Value
Category XPC850DEZT50BU
Manufacturer Freescale Semiconductor, Inc. (NXP Semiconductors)
Factory Lead Time 3 Weeks
Package / Case BGA
Moisture Sensitivity Level (MSL) 3
Terminal Finish TIN/LEAD/SILVER (SN/PB/AG)
Min Operating Temperature 0°C
Technology CMOS
Terminal Form BALL
Supply Voltage 3.3V
Frequency 50MHz
Pin Count 256
Supply Voltage-Max (Vsup) 3.465V
RAM Size 8kB
Bit Size 32
Address Bus Width 26
Low Power Mode YES
Format FIXED POINT
Number of Cores 1
Length 23mm
RoHS Status Non-RoHS Compliant
Product Attribute Attribute Value
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Surface Mount YES
Number of Terminations 256
Max Operating Temperature 95°C
Subcategory Microprocessors
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) NOT SPECIFIED
Reach Compliance Code not_compliant
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Qualification Status Not Qualified
Power Supplies 3.3V
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Halogen Free Not Halogen Free
Boundary Scan YES
External Data Bus Width 32
Integrated Cache YES
Height Seated (Max) 2.35mm
Width 23mm
Lead Free Contains Lead
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XPC850DEZT50BU Documents

Download datasheets and manufacturer documentation for XPC850DEZT50BU

  • Datasheets

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XPC850DEZT50BU brand manufacturers: Freescale Semiconductor, Inc. (NXP Semiconductors), Bonchip stock, XPC850DEZT50BU reference price. XPC850DEZT50BU parameters, XPC850DEZT50BU Datasheet PDF and pin diagram description download.You can use the XPC850DEZT50BU Pluggable Connectors, DSP Datesheet PDF, find XPC850DEZT50BU pin diagram and circuit diagram and usage method of function, XPC850DEZT50BU electronics tutorials.You can download from the Bonchip.
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