DD200S33K2CNOSA1 Tech Specifications

DD200S33K2CNOSA1 datasheet pdf and Diodes - Rectifiers - Arrays product details from Infineon Technologies stock available at Bonchip

Product Attribute Attribute Value
Category Discrete Semiconductors / Rectifier Diode Array
Manufacturer Infineon Technologies
Factory Lead Time 3 Weeks
Mount Screw
Package / Case Module
Diode Element Material SILICON
Published 2002
Part Status Last Time Buy
Number of Terminations 3
Max Operating Temperature 125°C
HTS Code 8541.10.00.80
Terminal Position UPPER
Peak Reflow Temperature (Cel) NOT SPECIFIED
Pin Count 3
Qualification Status Not Qualified
Element Configuration Dual
Diode Type Standard
Voltage - Forward (Vf) (Max) @ If 3.5V @ 200A
Forward Current 200A
Application GENERAL PURPOSE
Voltage - DC Reverse (Vr) (Max) 3300V
Max Collector Current 200A
Max Repetitive Reverse Voltage (Vrrm) 3.3kV
RoHS Status RoHS Compliant
Product Attribute Attribute Value
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Mounting Type Chassis Mount
Number of Pins 73
Packaging Tray
Pbfree Code no
Moisture Sensitivity Level (MSL) Not Applicable
ECCN Code EAR99
Min Operating Temperature -40°C
Subcategory Rectifier Diodes
Terminal Form UNSPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-XUFM-X3
Number of Elements 2
Speed Standard Recovery >500ns, > 200mA (Io)
Current - Reverse Leakage @ Vr 270A @ 1800V
Case Connection ISOLATED
Operating Temperature - Junction -40°C~125°C
Halogen Free Not Halogen Free
Number of Phases 1
Peak Reverse Current 275A
Reverse Voltage 3.3kV
Lead Free Contains Lead
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DD200S33K2CNOSA1 brand manufacturers: Infineon Technologies, Bonchip stock, DD200S33K2CNOSA1 reference price. DD200S33K2CNOSA1 parameters, DD200S33K2CNOSA1 Datasheet PDF and pin diagram description download.You can use the DD200S33K2CNOSA1 Pluggable Connectors, DSP Datesheet PDF, find DD200S33K2CNOSA1 pin diagram and circuit diagram and usage method of function, DD200S33K2CNOSA1 electronics tutorials.You can download from the Bonchip.
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