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TC234LP32F200NACKXUMA1 Tech Specifications

2MB 2M x 8 FLASHTriCore™32-BitMicrocontrollerAURIX™ Series 200MHz144-TQFP Exposed Pad

Product Attribute Attribute Value
Category Integrated Circuits (ICs) / Microcontrollers
Manufacturer Infineon Technologies
Factory Lead Time 3 Weeks
Factory Lead Time 26 Weeks
Package / Case 144-TQFP Exposed Pad
Operating Temperature -40°C~125°C TJ
Series AURIX™
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Technology CMOS
Terminal Form GULL WING
Frequency 200MHz
Interface CAN, LIN, SPI
Oscillator Type External
RAM Size 192K x 8
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Peripherals DMA, WDT
Core Size 32-Bit
Connectivity CANbus, FlexRay, LINbus, QSPI
Data Converter A/D 24x12b
DMA Channels YES
PWM Channels NO
On Chip Program ROM Width 8
RAM (bytes) 196608
Max Junction Temperature (Tj) 150°C
Number of SPI Channels 4
Length 16mm
Product Attribute Attribute Value
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Mounting Type Surface Mount
Surface Mount YES
Packaging Tape & Reel (TR)
Part Status Active
Number of Terminations 144
Terminal Position QUAD
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Memory Size 2MB
Number of I/O 78
Voltage - Supply (Vcc/Vdd) 1.17V~1.43V 2.97V~5.5V
Core Processor TriCore™
Program Memory Type FLASH
Program Memory Size 2MB 2M x 8
Bit Size 32
Has ADC YES
Data Bus Width 32b
EEPROM Size 128K x 8
Number of A/D Converters 2
Number of ADC Channels 24
Ambient Temperature Range High 125°C
Height 1.2mm
RoHS Status ROHS3 Compliant
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TC234LP32F200NACKXUMA1 Documents

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