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5ASXMB3E4F31I3N Tech Specifications

IC SOC CORTEX-A9 800MHZ 896FBGA

Product Attribute Attribute Value
Category Integrated Circuits (ICs) / SoC
Manufacturer Intel
Factory Lead Time 3 Weeks
Factory Lead Time 8 Weeks
Surface Mount YES
Packaging Tray
JESD-609 Code e1
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Terminal Finish TIN SILVER COPPER
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Pitch 1mm
Base Part Number 5ASXMB3
Supply Voltage-Max (Vsup) 1.18V
Number of I/O MCU - 208, FPGA - 250
RAM Size 64KB
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Height Seated (Max) 2.7mm
Width 31mm
Product Attribute Attribute Value
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Package / Case 896-BBGA, FCBGA
Operating Temperature -40°C~100°C TJ
Series Arria V SX
Part Status Active
Number of Terminations 896
HTS Code 8542.39.00.01
Terminal Form BALL
Supply Voltage 1.15V
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B896
Supply Voltage-Min (Vsup) 1.12V
Speed 800MHz
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Clock Frequency 670MHz
Architecture MCU, FPGA
Primary Attributes FPGA - 350K Logic Elements
Length 31mm
RoHS Status RoHS Compliant
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5ASXMB3E4F31I3N Documents

Download datasheets and manufacturer documentation for 5ASXMB3E4F31I3N

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