25-7068-7610 Tech Specifications

SOLDER FLUX-CORED/275 .020" 4LB

Product Attribute Attribute Value
Category Soldering, Desoldering, Rework Products / Solder
Manufacturer Kester
Factory Lead Time 3 Weeks
Wire Gauge 24 AWG, 25 SWG
Shipping Info -
Shelf Life Not Applicable
Process Lead Free
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Lead Free Status / RoHS Status Lead free / RoHS Compliant
Flux Type No-Clean
Detailed Description Lead Free No-Clean Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 24 AWG, 25 SWG Spool, 4 lbs (1.81kg)
Product Attribute Attribute Value
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Type Wire Solder
Shelf Life Start -
Series 275
Other Names 25-7068-7610-ND KE1925
Melting Point 423 ~ 424°F (217 ~ 218°C)
Form Spool, 4 lbs (1.81kg)
Diameter 0.020" (0.51mm)
Composition Sn96.5Ag3Cu0.5 (96.5/3/0.5)
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25-7068-7610 Documents

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Shipping Delivery Period Packages will be arranged for delivery within 1-2 days from the date of all items arrive at our warehouse. In stock items can be shipped out within 24 hours. Delivery Time depends on Shipping Method and Delivery Destinations.
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Returning Returning All returns should be made within 60 days of date of invoice and be accompanied by the original invoice number, certificate of guarantee card, parts picture and a brief explanation or test report of the reason for the return. Returns will not be accepted after 60 days. Returned merchandise must be in original packaging and in resalable condition. Parts returned due to customer error at time of quote or sale will not be accepted. Please contact customer service for a return authorization before return shipment.
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25-7068-7610 brand manufacturers: Kester, Bonchip stock, 25-7068-7610 reference price. 25-7068-7610 parameters, 25-7068-7610 Datasheet PDF and pin diagram description download.You can use the 25-7068-7610 Pluggable Connectors, DSP Datesheet PDF, find 25-7068-7610 pin diagram and circuit diagram and usage method of function, 25-7068-7610 electronics tutorials.You can download from the Bonchip.
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