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MCR006YRTJ120
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MCR006YRTJ120 Tech Specifications
RES SMD 12 OHM 5% 1/20W 0201
Product Attribute | Attribute Value |
---|---|
Category | Resistors / Chip Resistor - Surface Mount |
Manufacturer | LAPIS Semiconductor |
Factory Lead Time | 3 Weeks |
Tolerance | ±5% |
Supplier Device Package | 0201 |
Series | MCR |
Power (Watts) | 0.05W, 1/20W |
Package / Case | 0201 (0603 Metric) |
Number of Terminations | 2 |
Features | - |
Composition | Thick Film |
Product Attribute | Attribute Value |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Pbfree Code | yes |
Temperature Coefficient | ±250ppm/°C |
Size / Dimension | 0.024" L x 0.012" W (0.60mm x 0.30mm) |
Resistance (Ohms) | 12 |
Packaging | Original-Reel® |
Operating Temperature | -55°C ~ 125°C |
Height - Seated (Max) | 0.010" (0.26mm) |
Failure Rate | - |
MCR006YRTJ120 Documents
Download datasheets and manufacturer documentation for MCR006YRTJ120
-
Datasheets
1.MCR006YRTJ120.pdf 2.MCR006YRTJ120.pdf
Others include "MCR00" parts
The following parts include 'MCR00'
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MCR004 YZPF4503 | RHOM | Specialized Hot ICs | 15217 |
MCR004J-SMPLBK | LAPIS Semiconductor | Resistor Kits | 2759 |
MCR004J-SMPLBK | ROHM Semiconductor | Resistor Kits | |
MCR004RZPF4222 | LAPIS Semiconductor | Specialized Hot ICs | 40464 |
MCR004Y7PF6812 | LAPIS Semiconductor | Specialized Hot ICs | 15000 |
MCR004YZPEJ103 | LAPIS Semiconductor | Specialized Hot ICs | 30000 |
MCR004YZPEJ104 | LAPIS Semiconductor | Specialized Hot ICs | 50000 |
MCR004YZPEJ182 | LAPIS Semiconductor | Specialized Hot ICs | 15000 |
MCR004YZPF1000 | LAPIS Semiconductor | Chip Resistor - Surface Mount | 2712 |
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MCR006YRTJ120 brand manufacturers: LAPIS Semiconductor, Bonchip stock, MCR006YRTJ120 reference price. MCR006YRTJ120 parameters, MCR006YRTJ120 Datasheet PDF and pin diagram description download.You can use the MCR006YRTJ120 Pluggable Connectors, DSP Datesheet PDF, find MCR006YRTJ120 pin diagram and circuit diagram and usage method of function, MCR006YRTJ120 electronics tutorials.You can download from the Bonchip.
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