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56430-501 Tech Specifications
PELTIER MOD CP10,63,05,L1,W4.5
Product Attribute | Attribute Value |
---|---|
Category | Fans, Thermal Management / Thermal - Thermoelectric, Peltier Modules |
Manufacturer | Laird Technologies - Thermal Products |
Factory Lead Time | 3 Weeks |
Voltage - Max | 7.6V |
Resistance | 1.66 Ohms |
Outline L x W x H | 29.72mm x 15.00mm x 3.20mm |
Operating Temperature | 80°C |
Manufacturer Standard Lead Time | 9 Weeks |
Features | Lead Wires, Non-Sealed |
Delta Tmax @ Th | 67°C @ 25°C |
Product Attribute | Attribute Value |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Pbfree Code | yes |
Series | CP |
Qmax @ Th | 16.6W @ 25°C |
Other Names | 56430501 926-1025 CP10,63,05,L1,W4.5 |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Detailed Description | Peltier Module 29.72mm x 15.00mm x 3.20mm 16.6W @ 25°C 3.9A 80°C |
Current - Max | 3.9A |
56430-501 Documents
Download datasheets and manufacturer documentation for 56430-501
-
Datasheets
56430-501.pdf
Others include "56430" parts
The following parts include '56430'
Part # | Manufacturer | Category | Availability |
---|---|---|---|
56430 | Klein Tools | Specialized Tools | 2673 |
56430 | Klein Tools, Inc. | Specialized Tools | |
56430-501 | Laird Thermal Systems, Inc. | Thermal Modules | |
56430-510 | Laird Thermal Systems, Inc. | Thermal Modules |
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56430-501 brand manufacturers: Laird Technologies - Thermal Products, Bonchip stock, 56430-501 reference price. 56430-501 parameters, 56430-501 Datasheet PDF and pin diagram description download.You can use the 56430-501 Pluggable Connectors, DSP Datesheet PDF, find 56430-501 pin diagram and circuit diagram and usage method of function, 56430-501 electronics tutorials.You can download from the Bonchip.
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Shipping | Delivery Period | Packages will be arranged for delivery within 1-2 days from the date of all items arrive at our warehouse. In stock items can be shipped out within 24 hours. Delivery Time depends on Shipping Method and Delivery Destinations. |
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