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APA150-TQ100
In Stock
Min. : 1
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APA150-TQ100 Tech Specifications
IC FPGA 66 I/O 100TQFP
Product Attribute | Attribute Value |
---|---|
Category | Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array) |
Manufacturer | Microsemi |
Factory Lead Time | 3 Weeks |
Voltage - Supply | 2.3 V ~ 2.7 V |
Supplier Device Package | 100-TQFP (14x14) |
Package / Case | 100-LQFP |
Number of I/O | 66 |
Mounting Type | Surface Mount |
Product Attribute | Attribute Value |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Pbfree Code | yes |
Total RAM Bits | 36864 |
Series | ProASICPLUS |
Operating Temperature | 0°C ~ 70°C (TA) |
Number of Gates | 150000 |
APA150-TQ100 Documents
Download datasheets and manufacturer documentation for APA150-TQ100
-
Datasheets
APA150-TQ100.pdf
Others include "APA15" parts
The following parts include 'APA15'
Part # | Manufacturer | Category | Availability |
---|---|---|---|
APA150-BG456 | Microsemi | Embedded - FPGAs (Field Programmable Gate Array) | 2667 |
APA150-BG456 IC | ACTEL | Specialized Hot ICs | 472 |
APA150-BG456I | Microsemi | Embedded - FPGAs (Field Programmable Gate Array) | 2655 |
APA150-BG456I | Microsemi Corporation | FPGAs | |
APA150-BGG456 | Microsemi | Embedded - FPGAs (Field Programmable Gate Array) | 1201 |
APA150-BGG456 | Microsemi Corporation | FPGAs | |
APA150-BGG456I | Microsemi | Embedded - FPGAs (Field Programmable Gate Array) | 2570 |
APA150-FG144 | Microsemi | Embedded - FPGAs (Field Programmable Gate Array) | 991 |
APA150-FG144 | Microsemi Corporation | FPGAs | |
APA150-FG144A | Microsemi | Embedded - FPGAs (Field Programmable Gate Array) | 2689 |
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APA150-TQ100 brand manufacturers: Microsemi, Bonchip stock, APA150-TQ100 reference price. APA150-TQ100 parameters, APA150-TQ100 Datasheet PDF and pin diagram description download.You can use the APA150-TQ100 Pluggable Connectors, DSP Datesheet PDF, find APA150-TQ100 pin diagram and circuit diagram and usage method of function, APA150-TQ100 electronics tutorials.You can download from the Bonchip.
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