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0447692002 Tech Specifications

Conn Wire to Board RCP 20 POS 3mm Solder ST Thru-Hole Micro-Fit 3.0 BMI™ Tray

Product Attribute Attribute Value
Category Connectors / IC and Component Sockets
Manufacturer Molex
Factory Lead Time 3 Weeks
Factory Lead Time 9 Weeks
Mounting Type Through Hole
Insulation Material Liquid Crystal Polymer (LCP), Glass Filled
Packaging Tray
JESD-609 Code e3
Pbfree Code yes
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Connector Type Receptacle
Applications General Purpose, Telecommunications
Voltage - Rated 250VAC
Contact Finish - Mating Gold
DIN Conformance NO
Filter Feature NO
Mixed Contacts NO
Terminal Pitch 3mm
Style Board to Board or Cable
Pitch - Mating 0.118 3.00mm
Row Spacing - Mating 0.118 (3.00mm)
Contact Finish - Post Tin
Contact Finish Thickness - Mating 15.0μin 0.38μm
Stack Height (Mating) 16.86mm
RoHS Status ROHS3 Compliant
Product Attribute Attribute Value
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Contact Material Phosphor Bronze
Contact Shape Square
Operating Temperature -40°C~105°C
Series Micro-Fit 3.0 BMI 44769
Feature Board Guide
Part Status Active
Termination Solder
Number of Positions 20
Number of Rows 2
Fastening Type Push-Pull
MIL Conformance NO
IEC Conformance NO
Contact Type Female Socket
Current Rating (Amps) 5A
Insulation Height 0.535 13.60mm
Number of Positions Loaded All
Insulation Color Black
Contact Length - Post 0.134 3.40mm
UL Flammability Code 94V-0
Contact Finish Thickness - Post 100.0μin 2.54μm
Material Flammability Rating UL94 V-0
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0447692002 Documents

Download datasheets and manufacturer documentation for 0447692002

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0447692002 brand manufacturers: Molex, Bonchip stock, 0447692002 reference price. 0447692002 parameters, 0447692002 Datasheet PDF and pin diagram description download.You can use the 0447692002 Pluggable Connectors, DSP Datesheet PDF, find 0447692002 pin diagram and circuit diagram and usage method of function, 0447692002 electronics tutorials.You can download from the Bonchip.
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