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CYD09S72V18-167BBXC
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CYD09S72V18-167BBXC Tech Specifications
IC SRAM 9MBIT 167MHZ 256FBGA
Product Attribute | Attribute Value |
---|---|
Category | Integrated Circuits (ICs) / Memory |
Manufacturer | Cypress Semiconductor |
Factory Lead Time | 3 Weeks |
Voltage - Supply | 1.42 V ~ 1.58 V, 1.7 V ~ 1.9 V |
Speed | 167MHz |
Package / Case | 256-LBGA |
Memory Type | Volatile |
Memory Format | SRAM |
Product Attribute | Attribute Value |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Pbfree Code | yes |
Supplier Device Package | 256-FBGA (17x17) |
Packaging | Tray |
Operating Temperature | 0°C ~ 70°C (TA) |
Memory Size | 9Mb (128K x 72) |
Interface | Parallel |
CYD09S72V18-167BBXC Documents
Download datasheets and manufacturer documentation for CYD09S72V18-167BBXC
-
Datasheets
CYD09S72V18-167BBXC.pdf
Others include "CYD09" parts
The following parts include 'CYD09'
Part # | Manufacturer | Category | Availability |
---|---|---|---|
CYD09S18V18-167BBXC | Cypress Semiconductor | Memory | 2743 |
CYD09S18V18-167BBXC | Cypress Semiconductor Corp | Memory | |
CYD09S18V18-167BBXI | Cypress Semiconductor | Memory | 2661 |
CYD09S18V18-167BBXI | Cypress Semiconductor Corp | Memory | |
CYD09S18V18-200BBXC | Cypress Semiconductor | Memory | 2737 |
CYD09S18V18-200BBXC | Cypress Semiconductor Corp | Memory | |
CYD09S18V18-200BBXC IC | Cypress Semiconductor | Specialized Hot ICs | 444 |
CYD09S36V18-167BBXC | Cypress Semiconductor | Memory | 2600 |
CYD09S36V18-167BBXC | Cypress Semiconductor Corp | Memory | |
CYD09S36V18-200BBXC | Cypress Semiconductor | Memory | 2604 |
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CYD09S72V18-167BBXC brand manufacturers: Cypress Semiconductor, Bonchip stock, CYD09S72V18-167BBXC reference price. CYD09S72V18-167BBXC parameters, CYD09S72V18-167BBXC Datasheet PDF and pin diagram description download.You can use the CYD09S72V18-167BBXC Pluggable Connectors, DSP Datesheet PDF, find CYD09S72V18-167BBXC pin diagram and circuit diagram and usage method of function, CYD09S72V18-167BBXC electronics tutorials.You can download from the Bonchip.
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