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CYFB0072V33L-133BGXI Tech Specifications

CYFB0072V33L-133BGXI datasheet pdf and Logic - FIFOs Memory product details from Cypress Semiconductor Corp stock available at Bonchip

Product Attribute Attribute Value
Category Integrated Circuits (ICs) / FIFOs Memory
Manufacturer Cypress Semiconductor Corp
Factory Lead Time 3 Weeks
Contact Plating Copper, Silver, Tin
Package / Case FBGA
Published 2011
Part Status Obsolete
Number of Terminations 209
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Min Operating Temperature -40°C
Technology CMOS
Terminal Form BALL
Number of Functions 1
Terminal Pitch 1mm
[email protected] Reflow Temperature-Max (s) 40
Operating Supply Voltage 3.3V
Number of Circuits 2
Min Supply Voltage 3V
Element Configuration Dual
Max Supply Current 600mA
Data Bus Width 36b
Density 72 Mb
Word Size 36b
Bus Directional Unidirectional
Height Seated (Max) 1.96mm
Product Attribute Attribute Value
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Mount Surface Mount
Number of Pins 209
JESD-609 Code e1
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN Code EAR99
Max Operating Temperature 85°C
Additional Feature ALSO REQURIES 1.8 V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.5V
Frequency 133MHz
Pin Count 209
Temperature Grade INDUSTRIAL
Max Supply Voltage 3.6V
Memory Size 9MB
Nominal Supply Current 600mA
Access Time 10 ns
Memory Width 36
Sync/Async Synchronous
Memory IC Type MEMORY CIRCUIT
Retransmit Capability No
RoHS Status ROHS3 Compliant
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CYFB0072V18L-133BGXI Cypress Semiconductor Specialized Hot ICs 490

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