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MPC8555EVTALF Tech Specifications

MPC8555EVTALF datasheet pdf and Embedded - Microprocessors product details from NXP USA Inc. stock available at Bonchip

Product Attribute Attribute Value
Category Integrated Circuits (ICs) / Microprocessors
Manufacturer NXP USA Inc.
Factory Lead Time 3 Weeks
Package / Case 783-BBGA, FCBGA
Operating Temperature 0°C~105°C
Published 2002
JESD-609 Code e2
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN Code 5A002.A.1
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) 260
Terminal Pitch 1mm
Base Part Number MPC8555
Supply Voltage-Max (Vsup) 1.26V
Speed 667MHz
Core Processor PowerPC e500
Bit Size 32
Boundary Scan YES
External Data Bus Width 64
Integrated Cache YES
Ethernet 10/100/1000Mbps (2)
Graphics Acceleration No
USB USB 2.0 (1)
Co-Processors/DSP Communications; CPM, Security; SEC
Height Seated (Max) 3.75mm
RoHS Status ROHS3 Compliant
Product Attribute Attribute Value
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Surface Mount YES
Packaging Tray
Series MPC85xx
Part Status Obsolete
Number of Terminations 783
Terminal Finish TIN COPPER/TIN SILVER
Technology CMOS
Terminal Form BALL
Supply Voltage 1.2V
[email protected] Reflow Temperature-Max (s) 40
JESD-30 Code S-PBGA-B783
Supply Voltage-Min (Vsup) 1.14V
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Clock Frequency 166MHz
Address Bus Width 64
Low Power Mode YES
Format FLOATING POINT
Voltage - I/O 2.5V 3.3V
Number of Cores/Bus Width 1 Core 32-Bit
RAM Controllers DDR, SDRAM
Additional Interfaces DUART, I2C, PCI, SPI, TDM, UART
Security Features Cryptography, Random Number Generator
Length 29mm
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MPC8555EVTALF Documents

Download datasheets and manufacturer documentation for MPC8555EVTALF

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