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ND03P00333J--
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ND03P00333J-- Tech Specifications
ND03P00333J-- datasheet pdf and Temperature Sensors - NTC Thermistors product details from NA stock available at Bonchip
Product Attribute | Attribute Value |
---|---|
Category | ND03P00333J-- |
Manufacturer | |
Factory Lead Time | 3 Weeks |
Factory Lead Time | 27 Weeks |
Package / Case | Radial |
Number of Pins | 2 |
Tolerance | 5% |
Pbfree Code | yes |
Number of Terminations | 2 |
Terminal Finish | MATTE TIN |
Min Operating Temperature | -55°C |
Depth | 3mm |
Accuracy | 3 % |
Thermistor Application | TEMPERATURE COMPENSATION |
REACH SVHC | No SVHC |
Product Attribute | Attribute Value |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Pbfree Code | yes |
Mount | Through Hole |
Terminal Shape | WIRE |
Published | 2006 |
JESD-609 Code | e3 |
Part Status | Active |
Resistance | 33kOhm |
Max Operating Temperature | 150°C |
Packing Method | BULK |
Resistor Type | NTC THERMISTOR |
Bandwidth | 3MHz |
Radiation Hardening | No |
RoHS Status | RoHS Compliant |
ND03P00333J-- Documents
Download datasheets and manufacturer documentation for ND03P00333J--
-
Datasheets
Others include "ND03P" parts
The following parts include 'ND03P'
Part # | Manufacturer | Category | Availability |
---|---|---|---|
ND03P00223J-- | AVX Corporation | Temperature Sensors - NTC Thermistors | 2566 |
ND03P00333K-- | AVX Corporation | Temperature Sensors - NTC Thermistors | 2632 |
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ND03P00333J-- brand manufacturers: , Bonchip stock, ND03P00333J-- reference price. ND03P00333J-- parameters, ND03P00333J-- Datasheet PDF and pin diagram description download.You can use the ND03P00333J-- Pluggable Connectors, DSP Datesheet PDF, find ND03P00333J-- pin diagram and circuit diagram and usage method of function, ND03P00333J-- electronics tutorials.You can download from the Bonchip.
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Shipping | Delivery Period | Packages will be arranged for delivery within 1-2 days from the date of all items arrive at our warehouse. In stock items can be shipped out within 24 hours. Delivery Time depends on Shipping Method and Delivery Destinations. |
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