SMD291AX500T3 Tech Specifications

SOLDER PASTE SN63/PB37 500G

Product Attribute Attribute Value
Category Soldering, Desoldering, Rework Products / Solder
Manufacturer Chip Quik, Inc.
Factory Lead Time 3 Weeks
Wire Gauge -
Storage/Refrigeration Temperature 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start Date of Manufacture
Process Leaded
Lead Free Status / RoHS Status Contains lead / RoHS non-compliant
Flux Type No-Clean
Detailed Description Leaded No-Clean Solder Paste Sn63Pb37 (63/37) Jar, 17.64 oz (500g)
Product Attribute Attribute Value
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Type Solder Paste
Shipping Info Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Shelf Life 12 Months
Melting Point 361°F (183°C)
Form Jar, 17.64 oz (500g)
Diameter -
Composition Sn63Pb37 (63/37)
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SMD291AX500T3 Documents

Download datasheets and manufacturer documentation for SMD291AX500T3

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Returning Returning All returns should be made within 60 days of date of invoice and be accompanied by the original invoice number, certificate of guarantee card, parts picture and a brief explanation or test report of the reason for the return. Returns will not be accepted after 60 days. Returned merchandise must be in original packaging and in resalable condition. Parts returned due to customer error at time of quote or sale will not be accepted. Please contact customer service for a return authorization before return shipment.
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SMD291AX500T3 brand manufacturers: Chip Quik, Inc., Bonchip stock, SMD291AX500T3 reference price. SMD291AX500T3 parameters, SMD291AX500T3 Datasheet PDF and pin diagram description download.You can use the SMD291AX500T3 Pluggable Connectors, DSP Datesheet PDF, find SMD291AX500T3 pin diagram and circuit diagram and usage method of function, SMD291AX500T3 electronics tutorials.You can download from the Bonchip.
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