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TC1-200G Tech Specifications
HEAT SINK COMPOUND - HIGH DENSIT
Product Attribute | Attribute Value |
---|---|
Category | Thermal Management / Thermal Adhesives |
Manufacturer | Chip Quik Inc. |
Factory Lead Time | 3 Weeks |
Factory Lead Time | 4 Weeks |
Part Status | Active |
Type | Silicone Compound |
Shelf Life | 60 Months |
Shelf Life Start | Date of Manufacture |
RoHS Status | ROHS3 Compliant |
Product Attribute | Attribute Value |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Pbfree Code | yes |
Size / Dimension | 200 gram Jar |
Moisture Sensitivity Level (MSL) | Not Applicable |
Color | White |
Storage/Refrigeration Temperature | 37°F~77°F 3°C~25°C |
Thermal Conductivity | 0.67W/m-K |
TC1-200G Documents
Download datasheets and manufacturer documentation for TC1-200G
-
Datasheets
Others include "TC1-2" parts
The following parts include 'TC1-2'
Part # | Manufacturer | Category | Availability |
---|---|---|---|
TC1-20G | Chip Quik Inc. | Thermal Adhesives | |
TC1-2208-TR | MINI | Specialized Hot ICs | 2712 |
TC1-2509 | MINI | Specialized Hot ICs | 2728 |
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TC1-200G brand manufacturers: Chip Quik Inc., Bonchip stock, TC1-200G reference price. TC1-200G parameters, TC1-200G Datasheet PDF and pin diagram description download.You can use the TC1-200G Pluggable Connectors, DSP Datesheet PDF, find TC1-200G pin diagram and circuit diagram and usage method of function, TC1-200G electronics tutorials.You can download from the Bonchip.
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