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TE0808-04-15EG-1EK Tech Specifications

TE0808-04-15EG-1EK datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available at Bonchip

Product Attribute Attribute Value
Category Integrated Circuits (ICs) / Embedded ICs Modules
Manufacturer Trenz Electronic GmbH
Factory Lead Time 3 Weeks
Operating Temperature 0°C~85°C
Size / Dimension 2.05 x 2.99 52mmx76mm
Moisture Sensitivity Level (MSL) 1 (Unlimited)
RAM Size 4GB
Module/Board Type MPU Core
RoHS Status ROHS3 Compliant
Product Attribute Attribute Value
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Series TE0808
Part Status Obsolete
Connector Type B2B
Core Processor Zynq UltraScale+ XCZU15EG-1FFVC900E
Flash Size 128MB
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TE0808-04-15EG-1EK Documents

Download datasheets and manufacturer documentation for TE0808-04-15EG-1EK

  • Datasheets

Others include   "TE080"   parts

The following parts include  'TE080' 

Part # Manufacturer Category Availability
TE0801610000G Anytek (Amphenol Anytek) Terminal Blocks - Wire to Board 2644
TE08016100J0G Amphenol FCI Terminal Blocks - Wire to Board 2731
TE0801640000G Anytek (Amphenol Anytek) Terminal Blocks - Wire to Board 2618
TE08016400J0G Amphenol FCI Terminal Blocks - Wire to Board 2616
TE0803-01-02EG-1EA Trenz Electronic Embedded - Microcontroller or Microprocessor Modules 2799
TE0803-01-02EG-1EA Trenz Electronic GmbH Embedded ICs Modules
TE0803-01-03CG-1EA Trenz Electronic Embedded - Microcontroller or Microprocessor Modules 2764
TE0803-01-03CG-1EA Trenz Electronic GmbH Embedded ICs Modules
TE0803-01-04CG-1EA Trenz Electronic Embedded - Microcontroller or Microprocessor Modules 2614
TE0803-01-04CG-1EA Trenz Electronic GmbH Embedded ICs Modules

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