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TE0890-01-25-1C
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TE0890-01-25-1C Tech Specifications
TE0890-01-25-1C datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available at Bonchip
Product Attribute | Attribute Value |
---|---|
Category | Integrated Circuits (ICs) / Embedded ICs Modules |
Manufacturer | Trenz Electronic GmbH |
Factory Lead Time | 3 Weeks |
Factory Lead Time | 12 Weeks |
Series | TE0890 |
Part Status | Active |
Connector Type | Dual-pinout DIP-40 or 50mil 80 pin connector |
Core Processor | Xilinx Spartan-7 XC7S25 |
Flash Size | 64Mbit |
Product Attribute | Attribute Value |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Pbfree Code | yes |
Operating Temperature | 0°C~70°C |
Size / Dimension | 1.06 x 2.05 27.0mmx52.0mm |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Speed | 100MHz |
Module/Board Type | FPGA Core |
RoHS Status | ROHS3 Compliant |
TE0890-01-25-1C Documents
Download datasheets and manufacturer documentation for TE0890-01-25-1C
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Datasheets
Others include "TE089" parts
The following parts include 'TE089'
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TE0890-01-25-1C brand manufacturers: Trenz Electronic GmbH, Bonchip stock, TE0890-01-25-1C reference price. TE0890-01-25-1C parameters, TE0890-01-25-1C Datasheet PDF and pin diagram description download.You can use the TE0890-01-25-1C Pluggable Connectors, DSP Datesheet PDF, find TE0890-01-25-1C pin diagram and circuit diagram and usage method of function, TE0890-01-25-1C electronics tutorials.You can download from the Bonchip.
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