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TIOL1113DMWT Tech Specifications
IO LINK
Product Attribute | Attribute Value |
---|---|
Category | Integrated Circuits (ICs) / Interface - Drivers, Receivers, Transceivers |
Manufacturer | N/A |
Factory Lead Time | 3 Weeks |
Voltage - Supply | 7 V ~ 36 V |
Supplier Device Package | 10-VSON (3x2.5) |
Protocol | I/O-Link |
Package / Case | 10-VFDFN Exposed Pad |
Operating Temperature | -40°C ~ 125°C |
Mounting Type | Surface Mount |
Manufacturer Standard Lead Time | 8 Weeks |
Duplex | - |
Data Rate | 250kbps |
Product Attribute | Attribute Value |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Pbfree Code | yes |
Type | Transceiver |
Receiver Hysteresis | 750mV |
Packaging | Tape & Reel (TR) |
Other Names | 296-47084-2 TIOL1113DMWT-ND |
Number of Drivers/Receivers | 1/1 |
Moisture Sensitivity Level (MSL) | 2 (1 Year) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Detailed Description | 1/1 Transceiver I/O-Link 10-VSON (3x2.5) |
TIOL1113DMWT Documents
Download datasheets and manufacturer documentation for TIOL1113DMWT
-
Datasheets
Others include "TIOL1" parts
The following parts include 'TIOL1'
Part # | Manufacturer | Category | Availability |
---|---|---|---|
TIOL1113DMWR | N/A | Interface - Drivers, Receivers, Transceivers | 2572 |
TIOL1115DMWR | N/A | Interface - Drivers, Receivers, Transceivers | 2595 |
TIOL1115DMWT | N/A | Interface - Drivers, Receivers, Transceivers | 2767 |
TIOL1115EVM | N/A | Evaluation and Demonstration Boards and Kits | 2502 |
TIOL111DMWR | N/A | Interface - Drivers, Receivers, Transceivers | 2591 |
TIOL111DMWT | N/A | Interface - Drivers, Receivers, Transceivers | 2597 |
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TIOL1113DMWT brand manufacturers: N/A, Bonchip stock, TIOL1113DMWT reference price. TIOL1113DMWT parameters, TIOL1113DMWT Datasheet PDF and pin diagram description download.You can use the TIOL1113DMWT Pluggable Connectors, DSP Datesheet PDF, find TIOL1113DMWT pin diagram and circuit diagram and usage method of function, TIOL1113DMWT electronics tutorials.You can download from the Bonchip.
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