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XAZU3EG-1SBVA484Q Tech Specifications

XAZU3EG-1SBVA484Q

Product Attribute Attribute Value
Category Integrated Circuits (ICs) / SoC
Manufacturer Xilinx Inc.
Factory Lead Time 3 Weeks
Factory Lead Time 6 Weeks
Surface Mount YES
Packaging Tray
Part Status Active
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Pitch 0.8mm
JESD-30 Code S-PBGA-B484
Speed 500MHz, 1.2GHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Peripherals DMA, WDT
Architecture MPU, FPGA
Height Seated (Max) 2.61mm
Width 19mm
Product Attribute Attribute Value
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Package / Case 484-BFBGA, FCBGA
Operating Temperature -40°C~125°C TJ
Series Zynq® UltraScale+™ MPSoC EG
Number of Terminations 484
Technology CMOS
Terminal Form BALL
Supply Voltage 0.85V
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 128
RAM Size 1.8MB
Core Processor Quad ARM® Cortex®-A9 MPCore™ with CoreSight™, Dual ARM® Cortex®-R5 MPCore™ with CoreSight™
Connectivity CANbus, I2C, SPI, UART/USART, USB
Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Length 19mm
RoHS Status ROHS3 Compliant
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XAZU3EG-1SBVA484Q Documents

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