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XAZU5EV-1SFVC784Q
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XAZU5EV-1SFVC784Q Tech Specifications
IC FPGA SOC ZU EV Q100 784SBGA
Product Attribute | Attribute Value |
---|---|
Category | Integrated Circuits (ICs) / SoC |
Manufacturer | Xilinx Inc. |
Factory Lead Time | 3 Weeks |
Factory Lead Time | 11 Weeks |
Part Status | Active |
Number of Terminations | 784 |
Technology | CMOS |
Terminal Form | BALL |
Supply Voltage | 0.85V |
[email protected] Reflow Temperature-Max (s) | NOT SPECIFIED |
Operating Temperature (Max) | 125°C |
Temperature Grade | AUTOMOTIVE |
Height Seated (Max) | 3.32mm |
Width | 23mm |
Product Attribute | Attribute Value |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Pbfree Code | yes |
Surface Mount | YES |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
HTS Code | 8542.31.00.01 |
Terminal Position | BOTTOM |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Terminal Pitch | 0.8mm |
JESD-30 Code | S-PBGA-B784 |
Operating Temperature (Min) | -40°C |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
Length | 23mm |
RoHS Status | ROHS3 Compliant |
XAZU5EV-1SFVC784Q Documents
Download datasheets and manufacturer documentation for XAZU5EV-1SFVC784Q
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Datasheets
Others include "XAZU5" parts
The following parts include 'XAZU5'
Part # | Manufacturer | Category | Availability |
---|---|---|---|
XAZU5EV-1SFVC784I | Xilinx Inc. | SoC | |
XAZU5EV-L1SFVC784I | Xilinx Inc. | SoC |
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XAZU5EV-1SFVC784Q brand manufacturers: Xilinx Inc., Bonchip stock, XAZU5EV-1SFVC784Q reference price. XAZU5EV-1SFVC784Q parameters, XAZU5EV-1SFVC784Q Datasheet PDF and pin diagram description download.You can use the XAZU5EV-1SFVC784Q Pluggable Connectors, DSP Datesheet PDF, find XAZU5EV-1SFVC784Q pin diagram and circuit diagram and usage method of function, XAZU5EV-1SFVC784Q electronics tutorials.You can download from the Bonchip.
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Shipping | Delivery Period | Packages will be arranged for delivery within 1-2 days from the date of all items arrive at our warehouse. In stock items can be shipped out within 24 hours. Delivery Time depends on Shipping Method and Delivery Destinations. |
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