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FDB0260N1007L Tech Specifications

FDB0260N1007L datasheet pdf and Transistors - FETs, MOSFETs - Single product details from ON Semiconductor stock available at Bonchip

Product Attribute Attribute Value
Category Discrete Semiconductors / Single MOSFETs Transistors
Manufacturer ON Semiconductor
Factory Lead Time 3 Weeks
Factory Lead Time 16 Weeks
Mount Surface Mount
Package / Case TO-263-7, D2Pak (6 Leads + Tab)
Weight 1.312g
Packaging Tape & Reel (TR)
JESD-609 Code e3
Part Status Active
ECCN Code EAR99
HTS Code 8541.29.00.95
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Element Configuration Single
Rds On (Max) @ Id, Vgs 2.6m Ω @ 27A, 10V
Input Capacitance (Ciss) (Max) @ Vds 8545pF @ 50V
Gate Charge (Qg) (Max) @ Vgs 118nC @ 10V
Drive Voltage (Max Rds On,Min Rds On) 10V
Continuous Drain Current (ID) 200A
REACH SVHC No SVHC
Product Attribute Attribute Value
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Lifecycle Status ACTIVE (Last Updated: 4 days ago)
Mounting Type Surface Mount
Number of Pins 7
Operating Temperature -55°C~175°C TJ
Series PowerTrench®
Pbfree Code yes
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Terminal Finish Tin (Sn)
Technology MOSFET (Metal Oxide)
Reach Compliance Code not_compliant
Power Dissipation-Max 3.8W Ta 250W Tc
FET Type N-Channel
Vgs(th) (Max) @ Id 4V @ 250μA
Current - Continuous Drain (Id) @ 25°C 200A Tc
Drain to Source Voltage (Vdss) 100V
Vgs (Max) ±20V
Threshold Voltage 2.8V
RoHS Status ROHS3 Compliant
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FDB0260N1007L Documents

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