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FSBB30CH60C Tech Specifications

MODULE MOTION-SPM 600V SPM27-CC

Product Attribute Attribute Value
Category Discrete Semiconductors / Power Driver Modules
Manufacturer ON Semiconductor
Factory Lead Time 3 Weeks
Factory Lead Time 50 Weeks
Mount Through Hole
Package / Case 27-PowerDIP Module (1.205, 30.60mm)
Weight 21.978g
Series Motion SPM® 3
Pbfree Code yes
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN Code EAR99
Terminal Finish Tin (Sn)
Min Operating Temperature -40°C
Max Power Dissipation 106W
Number of Functions 4
Base Part Number FSBB30CH60
Voltage - Isolation 2500Vrms
Operating Supply Voltage 16.5V
Temperature Grade AUTOMOTIVE
Max Supply Voltage 16.5V
Max Current Rating 30A
Collector Emitter Voltage (VCEO) 2V
Max Junction Temperature (Tj) 150°C
Min Breakdown Voltage 600V
Length 44mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
Product Attribute Attribute Value
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Lifecycle Status ACTIVE, NOT REC (Last Updated: 2 days ago)
Mounting Type Through Hole
Number of Pins 27
Published 2011
JESD-609 Code e3
Part Status Not For New Designs
Number of Terminations 27
Type IGBT
Max Operating Temperature 125°C
HTS Code 8541.29.00.95
Terminal Position DUAL
Supply Voltage 15V
Number of Outputs 3
Output Voltage 600V
Polarity NPN
Configuration 3 Phase
Min Supply Voltage 13.5V
Output Current 30A
Max Collector Current 30A
Switching Frequency 20kHz
Height 7.5mm
Width 26.8mm
REACH SVHC No SVHC
Lead Free Lead Free
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FSBB30CH60C Documents

Download datasheets and manufacturer documentation for FSBB30CH60C

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FSBB30CH60C brand manufacturers: ON Semiconductor, Bonchip stock, FSBB30CH60C reference price. FSBB30CH60C parameters, FSBB30CH60C Datasheet PDF and pin diagram description download.You can use the FSBB30CH60C Pluggable Connectors, DSP Datesheet PDF, find FSBB30CH60C pin diagram and circuit diagram and usage method of function, FSBB30CH60C electronics tutorials.You can download from the Bonchip.
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