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N25S830HAS22I Tech Specifications

N25S830HAS22I datasheet pdf and Memory product details from ON Semiconductor stock available at Bonchip

Product Attribute Attribute Value
Category Integrated Circuits (ICs) / Memory
Manufacturer ON Semiconductor
Factory Lead Time 3 Weeks
Lifecycle Status ACTIVE (Last Updated: 4 days ago)
Mounting Type Surface Mount
Number of Pins 8
Packaging Tube
JESD-609 Code e3
Part Status Active
Number of Terminations 8
Terminal Finish Tin (Sn)
Voltage - Supply 2.7V~3.6V
Number of Functions 1
Base Part Number N25S830HA
Operating Supply Voltage 3V
Supply Voltage-Min (Vsup) 2.7V
Memory Size 256Kb 32K x 8
Nominal Supply Current 10mA
Clock Frequency 20MHz
Memory Format SRAM
Output Characteristics 3-STATE
Address Bus Width 1b
Standby Current-Max 0.000004A
Sync/Async Synchronous
Standby Voltage-Min 2.7V
Length 5mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
Product Attribute Attribute Value
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Mount Surface Mount
Package / Case 8-SOIC (0.154, 3.90mm Width)
Operating Temperature -40°C~85°C TA
Published 2000
Pbfree Code yes
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN Code EAR99
Technology CMOS
Terminal Position DUAL
Supply Voltage 3V
Pin Count 8
Supply Voltage-Max (Vsup) 3.6V
Interface 2-Wire, SPI, Serial
Number of Ports 1
Memory Type Volatile
Access Time 25 ns
Memory Interface SPI
Halogen Free Halogen Free
Density 256 kb
I/O Type SEPARATE
Word Size 8b
Height 1.5mm
Width 4mm
REACH SVHC No SVHC
Lead Free Lead Free
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N25S830HAS22I Documents

Download datasheets and manufacturer documentation for N25S830HAS22I

  • Datasheets

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N25S830HAS22I brand manufacturers: ON Semiconductor, Bonchip stock, N25S830HAS22I reference price. N25S830HAS22I parameters, N25S830HAS22I Datasheet PDF and pin diagram description download.You can use the N25S830HAS22I Pluggable Connectors, DSP Datesheet PDF, find N25S830HAS22I pin diagram and circuit diagram and usage method of function, N25S830HAS22I electronics tutorials.You can download from the Bonchip.
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