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TA810PW510RJ
In Stock
Min. : 1
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TA810PW510RJ Tech Specifications
RES 510 OHM 10W 5% RADIAL
Product Attribute | Attribute Value |
---|---|
Category | Resistors / Through Hole Resistors |
Manufacturer | Ohmite |
Factory Lead Time | 3 Weeks |
Tolerance | ±5% |
Supplier Device Package | Powerchip® |
Series | Power Chip® TA |
Power (Watts) | 10W |
Package / Case | Radial |
Number of Terminations | 4 |
Features | - |
Composition | Thick Film |
Product Attribute | Attribute Value |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Pbfree Code | yes |
Temperature Coefficient | ±50ppm/°C |
Size / Dimension | 1.085" L x 0.240" W (27.56mm x 6.10mm) |
Resistance (Ohms) | 510 |
Packaging | Bulk |
Operating Temperature | -55°C ~ 180°C |
Height - Seated (Max) | 1.020" (25.91mm) |
Failure Rate | - |
TA810PW510RJ Documents
Download datasheets and manufacturer documentation for TA810PW510RJ
-
Datasheets
TA810PW510RJ.pdf
Others include "TA810" parts
The following parts include 'TA810'
Part # | Manufacturer | Category | Availability |
---|---|---|---|
TA8101F | TOSHIBA | Specialized Hot ICs | 510 |
TA8101N | Toshiba Semiconductor and Storage | Specialized Hot ICs | 37 |
TA8102P | TOSH | Specialized Hot ICs | 2563 |
TA8103F | TOSHIBA | Specialized Hot ICs | 2646 |
TA8104F | TOSHIBA | Specialized Hot ICs | 591 |
TA8104F-TP1 | Toshiba Semiconductor and Storage | Specialized Hot ICs | 1703 |
TA8106F | TOSHIBA | Specialized Hot ICs | 1243 |
TA8106F MOS | Toshiba Semiconductor and Storage | Specialized Hot ICs | 559 |
TA8106FG | TOS | Specialized Hot ICs | 2693 |
TA8106FG(M) | Toshiba Semiconductor and Storage | Specialized Hot ICs | 88 |
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TA810PW510RJ brand manufacturers: Ohmite, Bonchip stock, TA810PW510RJ reference price. TA810PW510RJ parameters, TA810PW510RJ Datasheet PDF and pin diagram description download.You can use the TA810PW510RJ Pluggable Connectors, DSP Datesheet PDF, find TA810PW510RJ pin diagram and circuit diagram and usage method of function, TA810PW510RJ electronics tutorials.You can download from the Bonchip.
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