514-83-600M35-001148 Tech Specifications

CONN SOCKET BGA 600POS GOLD

Product Attribute Attribute Value
Category Connectors, Interconnects / Sockets for ICs, Transistors
Manufacturer Preci-Dip
Factory Lead Time 3 Weeks
Type BGA
Termination Solder
Pitch - Post 0.100" (2.54mm)
Packaging Bulk
Number of Positions or Pins (Grid) 600 (35 x 35)
Material Flammability Rating UL94 V-0
Features Open Frame
Contact Resistance 10 mOhm
Contact Material - Mating Beryllium Copper
Contact Finish Thickness - Mating 29.5µin (0.75µm)
Contact Finish - Mating Gold
Product Attribute Attribute Value
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Termination Post Length 0.055" (1.40mm)
Series 514
Pitch - Mating 0.100" (2.54mm)
Operating Temperature -55°C ~ 125°C
Mounting Type Surface Mount
Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Current Rating 1A
Contact Material - Post Brass
Contact Finish Thickness - Post -
Contact Finish - Post Tin
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514-83-600M35-001148 Documents

Download datasheets and manufacturer documentation for 514-83-600M35-001148

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514-83-175-16-071117 Preci-Dip Sockets for ICs, Transistors 2504
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