BU8874 Tech Specifications

BU8874 datasheet pdf and Interface - Telecom product details from ROHM Semiconductor stock available at Bonchip

Product Attribute Attribute Value
Category Integrated Circuits (ICs) / Telecom Interface ICs
Manufacturer ROHM Semiconductor
Factory Lead Time 3 Weeks
Mount Through Hole
Package / Case 8-DIP (0.300, 7.62mm)
Operating Temperature -10°C~70°C
Published 1998
Pbfree Code yes
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Terminal Finish Tin/Copper (Sn/Cu)
Max Power Dissipation 500mW
Voltage - Supply 4.75V~5.25V
Peak Reflow Temperature (Cel) 260
Terminal Pitch 2.54mm
[email protected] Reflow Temperature-Max (s) 10
JESD-30 Code R-PDIP-T8
Qualification Status Not Qualified
Power Supplies 5V
Operating Supply Current 2.2mA
Logic Function Receiver
Height 2.89mm
Width 6.5mm
Lead Free Lead Free
Product Attribute Attribute Value
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Mounting Type Through Hole
Weight 930.006106mg
Packaging Tube
JESD-609 Code e2
Part Status Obsolete
Number of Terminations 8
Subcategory Telecom Signaling Circuits
Technology CMOS
Terminal Position DUAL
Supply Voltage 5V
Frequency 4.19MHz
Base Part Number BU887*
Function Receiver, DTMF
Operating Supply Voltage 5V
Number of Circuits 1
Supply Current-Max 0.0034mA
Telecom IC Type DTMF SIGNALING CIRCUIT
Length 9.3mm
RoHS Status ROHS3 Compliant
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BU8874 Documents

Download datasheets and manufacturer documentation for BU8874

  • Datasheets

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BU8872FS-E2 LAPIS Semiconductor Interface - Telecom 3186
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BU8874 brand manufacturers: ROHM Semiconductor, Bonchip stock, BU8874 reference price. BU8874 parameters, BU8874 Datasheet PDF and pin diagram description download.You can use the BU8874 Pluggable Connectors, DSP Datesheet PDF, find BU8874 pin diagram and circuit diagram and usage method of function, BU8874 electronics tutorials.You can download from the Bonchip.
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