CL21A335KPFNNNE Tech Specifications

Cap Ceramic 3.3uF 10V X5R 10% SMD 0805 85C Embossed T/R

Product Attribute Attribute Value
Category CL21A335KPFNNNE
Manufacturer Samsung Electro-Mechanics
Factory Lead Time 3 Weeks
Factory Lead Time 22 Weeks
Mounting Type Surface Mount, MLCC
Terminal Shape WRAPAROUND
Operating Temperature -55°C~85°C
Published 1997
Size / Dimension 0.079Lx0.049W 2.00mmx1.25mm
JESD-609 Code e3
Part Status Active
Number of Terminations 2
Temperature Coefficient X5R
Applications General Purpose
Capacitance 3.3μF
Packing Method TR, EMBOSSED PLASTIC, 7 INCH
Case Code (Metric) 2012
Capacitor Type CERAMIC CAPACITOR
Multilayer Yes
Thickness (Max) 0.053 1.35mm
Radiation Hardening No
Product Attribute Attribute Value
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Mount Surface Mount
Package / Case 0805 (2012 Metric)
Dielectric Material CERAMIC
Packaging Tape & Reel (TR)
Series CL
Tolerance ±10%
Pbfree Code yes
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN Code EAR99
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier
HTS Code 8532.24.00.20
Voltage - Rated DC 10V
Depth 1.25mm
Case Code (Imperial) 0805
Temperature Characteristics Code X5R
Height 1.25mm
Thickness 1.3462mm
RoHS Status ROHS3 Compliant
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CL21A335KPFNNNE Documents

Download datasheets and manufacturer documentation for CL21A335KPFNNNE

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CL21A335KPFNNNE brand manufacturers: Samsung Electro-Mechanics, Bonchip stock, CL21A335KPFNNNE reference price. CL21A335KPFNNNE parameters, CL21A335KPFNNNE Datasheet PDF and pin diagram description download.You can use the CL21A335KPFNNNE Pluggable Connectors, DSP Datesheet PDF, find CL21A335KPFNNNE pin diagram and circuit diagram and usage method of function, CL21A335KPFNNNE electronics tutorials.You can download from the Bonchip.
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