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6364306-1 Tech Specifications

Conn VHDCI RCP 68/68 POS 0.8mm Solder RA Thru-Hole 136 Terminal 2 Port

Product Attribute Attribute Value
Category Connectors / Centronics Connectors
Manufacturer TE Connectivity AMP Connectors
Factory Lead Time 3 Weeks
Factory Lead Time 25 Weeks
Contact Material Bronze
Mounting Type Panel Mount, Through Hole, Right Angle
Housing Material Thermoplastic
Packaging Box
Series CHAMP .031
Feature Board Lock
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Number of Positions 68, 68
MIL Conformance NO
IEC Conformance NO
Mixed Contacts NO
Pitch 800μm
Orientation Right Angle
Depth 24.23mm
Contact Finish Gold
UL Flammability Code 94V-0
Lead Length 2.27mm
Flange Feature Housing/Shell (M2.6)
Connector Style Outer Shroud Contacts
Circuit Application Signal
Hole Diameter 1.2 mm
Mating Connector Lock With
Contact Finish Thickness 30.0μin 0.76μm
PCB Thickness 1.6mm
Flammability Rating UL94 V-0
Product Attribute Attribute Value
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Lifecycle Status ACTIVE (Last Updated: 5 days ago)
Mount Through Hole
Shell Material Steel
PCB Mounting Orientation Right Angle
Published 1999
JESD-609 Code e3
Part Status Active
Number of Terminations 136
Connector Type Stacked, 2 Receptacles
Number of Rows 2
DIN Conformance NO
Filter Feature NO
Option GENERAL PURPOSE
Total Number of Contacts 68
Shielding Unshielded
Current Rating 300mA
Contact Gender FEMALE
Housing Color Black
Empty Shell NO
Plating Copper, Nickel
Sealable No
Number of Signal Positions 68
Preloaded Yes
Length 42.7mm
Plating Thickness 760 nm
RoHS Status RoHS Compliant
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6364306-1 Documents

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6364306-1 brand manufacturers: TE Connectivity AMP Connectors, Bonchip stock, 6364306-1 reference price. 6364306-1 parameters, 6364306-1 Datasheet PDF and pin diagram description download.You can use the 6364306-1 Pluggable Connectors, DSP Datesheet PDF, find 6364306-1 pin diagram and circuit diagram and usage method of function, 6364306-1 electronics tutorials.You can download from the Bonchip.
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