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BZV55C18 L0G Tech Specifications
DIODE ZENER 18V 500MW MINI MELF
Product Attribute | Attribute Value |
---|---|
Category | Discrete Semiconductor Products / Diodes - Zener - Single |
Manufacturer | TSC (Taiwan Semiconductor) |
Factory Lead Time | 3 Weeks |
Voltage - Zener (Nom) (Vz) | 18V |
Tolerance | ±5% |
Power - Max | 500mW |
Package / Case | DO-213AC, MINI-MELF, SOD-80 |
Operating Temperature | -65°C ~ 175°C (TJ) |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Detailed Description | Zener Diode 18V 500mW ±5% Surface Mount Mini MELF |
Product Attribute | Attribute Value |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Pbfree Code | yes |
Voltage - Forward (Vf) (Max) @ If | 1V @ 10mA |
Supplier Device Package | Mini MELF |
Packaging | Tape & Reel (TR) |
Other Names | BZV55C18 L0G-ND BZV55C18L0G |
Mounting Type | Surface Mount |
Manufacturer Standard Lead Time | 30 Weeks |
Impedance (Max) (Zzt) | 50 Ohms |
Current - Reverse Leakage @ Vr | 100nA @ 13V |
BZV55C18 L0G Documents
Download datasheets and manufacturer documentation for BZV55C18 L0G
-
Datasheets
BZV55C18 L0G.pdf
Others include "BZV55" parts
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BZV55-5V1 | NXP | Specialized Hot ICs | 13000 |
BZV55-7.5V | PHILIPS | Specialized Hot ICs | 8000 |
BZV55-B/C2V7 | PHILIPS | Specialized Hot ICs | 37800 |
BZV55-B10 | NXP | Specialized Hot ICs | 400458 |
BZV55-B10,115 | Nexperia | Diodes - Zener - Single | 2706 |
BZV55-B10,115 | Nexperia USA Inc. | Zener Single Diodes | |
BZV55-B11 | NXP | Specialized Hot ICs | 5267 |
BZV55-B11,115 | Nexperia | Diodes - Zener - Single | 2743 |
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BZV55C18 L0G brand manufacturers: TSC (Taiwan Semiconductor), Bonchip stock, BZV55C18 L0G reference price. BZV55C18 L0G parameters, BZV55C18 L0G Datasheet PDF and pin diagram description download.You can use the BZV55C18 L0G Pluggable Connectors, DSP Datesheet PDF, find BZV55C18 L0G pin diagram and circuit diagram and usage method of function, BZV55C18 L0G electronics tutorials.You can download from the Bonchip.
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