TH58BVG2S3HTA00 Tech Specifications

IC FLASH 4G PARALLEL 48TSOP I

Product Attribute Attribute Value
Category Integrated Circuits (ICs) / Memory
Manufacturer Toshiba Memory America, Inc.
Factory Lead Time 3 Weeks
Write Cycle Time - Word, Page 25ns
Technology FLASH - NAND (SLC)
Series Benand™
Package / Case 48-TFSOP (0.724", 18.40mm Width)
Operating Temperature 0°C ~ 70°C (TA)
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Memory Size 4Gb (512M x 8)
Memory Format FLASH
Detailed Description FLASH - NAND (SLC) Memory IC 4Gb (512M x 8) Parallel 25ns 48-TSOP I
Product Attribute Attribute Value
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Voltage - Supply 2.7 V ~ 3.6 V
Supplier Device Package 48-TSOP I
Packaging Tray
Other Names TH58BVG2S3HTA00B4H TH58BVG2S3HTA00YCJ TH58BVG2S3HTA00YCL
Mounting Type Surface Mount
Memory Type Non-Volatile
Memory Interface Parallel
Lead Free Status / RoHS Status Lead free / RoHS Compliant
Access Time 25ns
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TH58BVG2S3HTA00 Documents

Download datasheets and manufacturer documentation for TH58BVG2S3HTA00

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