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THGAF8G8T23BAIL Tech Specifications

IC FLASH 256G UFS 153WFBGA

Product Attribute Attribute Value
Category Integrated Circuits (ICs) / Memory
Manufacturer Toshiba Memory America, Inc.
Factory Lead Time 3 Weeks
Write Cycle Time - Word, Page -
Technology FLASH - NAND
Series Consumer UFS
Package / Case 153-WFBGA
Operating Temperature -25°C ~ 85°C (TC)
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Memory Size 256Gb (32G x 8)
Memory Format FLASH
Detailed Description FLASH - NAND Memory IC 256Gb (32G x 8) UFS 153-WFBGA (11.5x13)
Product Attribute Attribute Value
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Voltage - Supply 2.7 V ~ 3.6 V
Supplier Device Package 153-WFBGA (11.5x13)
Packaging Tray
Other Names THGAF8G8T23BAILYHJ
Mounting Type Surface Mount
Memory Type Non-Volatile
Memory Interface UFS
Lead Free Status / RoHS Status Lead free / RoHS Compliant
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THGAF8G8T23BAIL Documents

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THGAF8G8T23BAIL brand manufacturers: Toshiba Memory America, Inc., Bonchip stock, THGAF8G8T23BAIL reference price. THGAF8G8T23BAIL parameters, THGAF8G8T23BAIL Datasheet PDF and pin diagram description download.You can use the THGAF8G8T23BAIL Pluggable Connectors, DSP Datesheet PDF, find THGAF8G8T23BAIL pin diagram and circuit diagram and usage method of function, THGAF8G8T23BAIL electronics tutorials.You can download from the Bonchip.
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