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SUD50P04-23-GE3 Tech Specifications
MOSFET P-CH 40V 8.2A TO252
Product Attribute | Attribute Value |
---|---|
Category | Discrete Semiconductor Products / Transistors - FETs, MOSFETs - Single |
Manufacturer | Vishay / Siliconix |
Factory Lead Time | 3 Weeks |
Vgs(th) (Max) @ Id | 2V @ 250µA |
Supplier Device Package | TO-252, (D-Pak) |
Rds On (Max) @ Id, Vgs | 23 mOhm @ 15A, 10V |
Packaging | Tape & Reel (TR) |
Operating Temperature | -55°C ~ 175°C (TJ) |
Input Capacitance (Ciss) (Max) @ Vds | 1880pF @ 20V |
FET Type | P-Channel |
Drain to Source Voltage (Vdss) | 40V |
Product Attribute | Attribute Value |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Pbfree Code | yes |
Technology | MOSFET (Metal Oxide) |
Series | TrenchFET® |
Power Dissipation (Max) | 3.1W (Ta), 45.4W (Tc) |
Package / Case | TO-252-3, DPak (2 Leads + Tab), SC-63 |
Mounting Type | Surface Mount |
Gate Charge (Qg) (Max) @ Vgs | 65nC @ 10V |
FET Feature | - |
Current - Continuous Drain (Id) @ 25°C | 8.2A (Ta), 20A (Tc) |
SUD50P04-23-GE3 Documents
Download datasheets and manufacturer documentation for SUD50P04-23-GE3
-
Datasheets
SUD50P04-23-GE3.pdf
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SUD50N02-04P-E3 | Electro-Films (EFI) / Vishay | Transistors - FETs, MOSFETs - Single | 4386 |
SUD50N02-04P-E3 | Vishay / Siliconix | Transistors - FETs, MOSFETs - Single | 22201 |
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SUD50N02-06-E3 | VISHAY | Specialized Hot ICs | 1365 |
SUD50N02-06P | TO-252 | Specialized Hot ICs | 20653 |
SUD50N02-06P-E3 | Electro-Films (EFI) / Vishay | Transistors - FETs, MOSFETs - Single | 31136 |
SUD50N02-06P-E3 | Vishay / Siliconix | Transistors - FETs, MOSFETs - Single | 1363 |
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SUD50P04-23-GE3 brand manufacturers: Vishay / Siliconix, Bonchip stock, SUD50P04-23-GE3 reference price. SUD50P04-23-GE3 parameters, SUD50P04-23-GE3 Datasheet PDF and pin diagram description download.You can use the SUD50P04-23-GE3 Pluggable Connectors, DSP Datesheet PDF, find SUD50P04-23-GE3 pin diagram and circuit diagram and usage method of function, SUD50P04-23-GE3 electronics tutorials.You can download from the Bonchip.
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