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XC2S100-6FGG256C Tech Specifications

IC FPGA 196 I/O 256FBGA

Product Attribute Attribute Value
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Manufacturer Xilinx
Factory Lead Time 3 Weeks
Voltage - Supply 2.375 V ~ 2.625 V
Supplier Device Package 256-FBGA (17x17)
Package / Case 256-BGA
Number of Logic Elements/Cells 2700
Number of I/O 176
Mounting Type Surface Mount
Product Attribute Attribute Value
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Total RAM Bits 40960
Series Spartan®-II
Operating Temperature 0°C ~ 85°C (TJ)
Number of LABs/CLBs 600
Number of Gates 100000
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XC2S100-6FGG256C Documents

Download datasheets and manufacturer documentation for XC2S100-6FGG256C

Others include   "XC2S1"   parts

The following parts include  'XC2S1' 

Part # Manufacturer Category Availability
XC2S100 Xilinx Specialized Hot ICs 10
XC2S100-1FG256C Xilinx Specialized Hot ICs 770
XC2S100-1FG256I Xilinx Specialized Hot ICs 731
XC2S100-1FGG256C Xilinx Specialized Hot ICs 794
XC2S100-1FGG256I Xilinx Specialized Hot ICs 630
XC2S100-2FG256C Xilinx Specialized Hot ICs 816
XC2S100-2FG256I Xilinx Specialized Hot ICs 740
XC2S100-2FGG256C Xilinx Specialized Hot ICs 704
XC2S100-2FGG256I Xilinx Specialized Hot ICs 751
XC2S100-3FG256C Xilinx Specialized Hot ICs 793

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