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XC2S50E-6PQ208I
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XC2S50E-6PQ208I Tech Specifications
IC FPGA 146 I/O 208QFP
Product Attribute | Attribute Value |
---|---|
Category | Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array) |
Manufacturer | Xilinx |
Factory Lead Time | 3 Weeks |
Voltage - Supply | 1.71 V ~ 1.89 V |
Supplier Device Package | 208-PQFP (28x28) |
Package / Case | 208-BFQFP |
Number of Logic Elements/Cells | 1728 |
Number of I/O | 146 |
Mounting Type | Surface Mount |
Product Attribute | Attribute Value |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Pbfree Code | yes |
Total RAM Bits | 32768 |
Series | Spartan®-IIE |
Operating Temperature | -40°C ~ 100°C (TJ) |
Number of LABs/CLBs | 384 |
Number of Gates | 50000 |
XC2S50E-6PQ208I Documents
Download datasheets and manufacturer documentation for XC2S50E-6PQ208I
-
Datasheets
XC2S50E-6PQ208I.pdf
Others include "XC2S5" parts
The following parts include 'XC2S5'
Part # | Manufacturer | Category | Availability |
---|---|---|---|
XC2S50-5FG256C | Xilinx | Embedded - FPGAs (Field Programmable Gate Array) | 2253 |
XC2S50-5FG256C | Xilinx Inc. | FPGAs | |
XC2S50-5FG256I | Xilinx | Embedded - FPGAs (Field Programmable Gate Array) | 607 |
XC2S50-5FG256I | Xilinx Inc. | FPGAs | |
XC2S50-5FG256Q | Xilinx | Specialized Hot ICs | 1986 |
XC2S50-5FG256Q IC | Xilinx | Specialized Hot ICs | 1877 |
XC2S50-5FGG256C | Xilinx | Embedded - FPGAs (Field Programmable Gate Array) | 2472 |
XC2S50-5FGG256C | Xilinx Inc. | FPGAs | |
XC2S50-5FGG256I | Xilinx | Embedded - FPGAs (Field Programmable Gate Array) | 1211 |
XC2S50-5I/FG256 | XILINX | Specialized Hot ICs | 2516 |
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XC2S50E-6PQ208I brand manufacturers: Xilinx, Bonchip stock, XC2S50E-6PQ208I reference price. XC2S50E-6PQ208I parameters, XC2S50E-6PQ208I Datasheet PDF and pin diagram description download.You can use the XC2S50E-6PQ208I Pluggable Connectors, DSP Datesheet PDF, find XC2S50E-6PQ208I pin diagram and circuit diagram and usage method of function, XC2S50E-6PQ208I electronics tutorials.You can download from the Bonchip.
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