Microchip Introduces New Plug-and-Play Bluetooth Solutions to Simplify RF Design
Bluetooth Low Energy for industrial applications.
Included in the new product lineup are the WBZ350 module, which is 2.4-GHz RF-capable, and the PIC32CX-BZ3 system-on-chip (SoC). Both of these products simplify the integration of BLE-capable microcontrollers (MCUs) into various designs. Additionally, Microchip is launching the fully plug-and-play RNB350 module as part of this release.
These new low-power wireless chipsets are designed for applications in IoT smart homes and buildings, industrial IoT (IIoT), and automotive systems.
The Challenge of BLE Design
Bluetooth Low Energy (BLE) is a short-range, low-power wireless data communication protocol primarily utilized in battery-powered, remote, or portable consumer and industrial systems. While BLE typically operates over a short distance, it can support ranges up to 200 meters. Consumers are most familiar with BLE for wirelessly connecting external devices such as watches, wearables, and speakers to their phones or computers. However, this widely adopted standard is also prevalent in medical and industrial applications.
Bluetooth transceivers function at 2.4 GHz within the industrial, scientific, and medical (ISM) band, spanning from 2.402 to 2.480 GHz. Microchip’s Bluetooth radios support data rates up to 2 Mbps while consuming only a few milliamperes during transmit and receive cycles.
Despite its widespread use, designing and working with BLE transceivers can be challenging and often requires specialized skills and experience. According to Rishi Vasuki, Microchip's VP of Wireless Solutions, today’s BLE system designers need a range of options that cater to different skill levels, development timelines, and application requirements.
Microchip's New RF Chipsets and Modules
A Bluetooth microcontroller (or SoC) provides the core functionality required to implement transceiver protocols. Microchip’s PIC32CX-BZ3 SoC incorporates an Arm-based Cortex-M4 processor, onboard power, memory (Flash and SRAM), I/O interfaces (SPI, GPIO, I2C, etc.), and a complete BLE wireless subsystem to support BLE and other IEEE 802.15.4 protocols.
One of the biggest challenges in designing a wireless transceiver extends beyond the silicon chipset into the complexities of antenna design and other aspects of radio frequency (RF) signal conditioning. For engineers with RF system expertise, a Bluetooth LE SoC serves as an excellent starting point for developing a customized Bluetooth solution.
PiC32CX-BZ3 2.4-GHz system-on-chip (SoC) RF solution.
For designers who lack the time, experience, or need to develop a customized RF solution, Microchip offers the RNBD350 — a fully plug-and-play Bluetooth module. This module includes all necessary radio components and subsystems, such as a printed antenna and matching circuits, ensuring seamless integration.Packaged in a 30-pin, surface-mountable format (13.4 mm x 18.7 mm x 2.8 mm), the RNBD350 is a fully certified BLE solution. It can be quickly incorporated into existing product platforms to add wireless connectivity with minimal effort.
RNBD350 2.4-GHz RF module with a printed antenna.
The module also supports Zigbee 3.0 and proprietary 2.4 GHz protocols in addition to BLE.
Printed Antenna
When considering antennas that efficiently collect and transmit RF energy, large metal discs or similar structures often come to mind.
WBZ350 module antenna radiation pattern (Phi = 0°).
However, for a 2.4 GHz Bluetooth radio, a simple yet meticulously designed metal trace on the surface of the PCB module can serve as an effective antenna. Microchip’s module solutions feature a printed antenna approximately 16 mm in length, with a peak gain of 3.5 dBi at 2,420 MHz.
