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MTSMC-LAT1 Tech Specifications
EMBEDDED LTE CAT 3 MODEM/SERIAL
Product Attribute | Attribute Value |
---|---|
Category | Computers, Office - Components, Accessories / Modems |
Manufacturer | Multi-Tech Systems, Inc. |
Factory Lead Time | 3 Weeks |
Voltage - Supply | 3.3 V ~ 5 V |
Region Utilized | North America |
Manufacturer Standard Lead Time | 12 Weeks |
Detailed Description | Modem LTE Cat 3 |
Data Format | LTE Cat 3 |
Product Attribute | Attribute Value |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Pbfree Code | yes |
Series | SocketModem® Cell |
Mounting Type | PCB |
Interface | Serial |
Data Rate | 921.6K |
MTSMC-LAT1 Documents
Download datasheets and manufacturer documentation for MTSMC-LAT1
-
Datasheets
1.MTSMC-LAT1.pdf 2.MTSMC-LAT1.pdf
Others include "MTSMC" parts
The following parts include 'MTSMC'
Part # | Manufacturer | Category | Availability |
---|---|---|---|
MTSMC-C-N15.R2 | Multi-Tech Systems, Inc. | RF Transceiver Modules | 2698 |
MTSMC-C-N15.R2 | Multi-Tech Systems Inc. | RF Transceiver Modules | |
MTSMC-C-N15.R2-SP | Multi-Tech Systems, Inc. | RF Transceiver Modules | 2511 |
MTSMC-C-N15.R2-SP | Multi-Tech Systems Inc. | RF Transceiver Modules | |
MTSMC-C-N16.R2 | Multi-Tech Systems, Inc. | RF Transceiver Modules | 2548 |
MTSMC-C-N16.R2 | Multi-Tech Systems Inc. | RF Transceiver Modules | |
MTSMC-C-N16.R2-SP | Multi-Tech Systems, Inc. | RF Transceiver Modules | 2774 |
MTSMC-C-N16.R2-SP | Multi-Tech Systems Inc. | RF Transceiver Modules | |
MTSMC-C-N2.R-SP | Multi-Tech Systems, Inc. | RF Transceiver Modules | 2651 |
MTSMC-C-N2.R-SP | Multi-Tech Systems Inc. | RF Transceiver Modules |
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MTSMC-LAT1 brand manufacturers: Multi-Tech Systems, Inc., Bonchip stock, MTSMC-LAT1 reference price. MTSMC-LAT1 parameters, MTSMC-LAT1 Datasheet PDF and pin diagram description download.You can use the MTSMC-LAT1 Pluggable Connectors, DSP Datesheet PDF, find MTSMC-LAT1 pin diagram and circuit diagram and usage method of function, MTSMC-LAT1 electronics tutorials.You can download from the Bonchip.
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